--- title: "Fraunhofer IPMS startet die APECS-Pilotlinie in Dresden, Freistaat Sachsen; eröffnet neue Tech-Möglichkeiten und stärkt regionale Wertschöpfungsketten langfristig" sdDatePublished: "2026-04-29T07:07:00Z" source: "https://www.ipms.fraunhofer.de/content/dam/ipms/common/annualreports/Fraunhofer%20IPMS%20-%20Annual%20Report%202025_2026.pdf" topics: - name: "scientific research" identifier: "medtop:20000735" locations: - "Bavaria" - "Austria" - "Portugal" - "Germany" - "Spain" - "Berlin" - "Schleswig-Holstein" - "South Korea" - "Switzerland" - "Baden-Württemberg" - "Greece" - "Dresden" - "Belgium" - "Taiwan" - "New York" - "Netherlands" - "Norway" - "North Rhine-Westphalia" - "Finland" - "United Kingdom" - "Albany" - "Brandenburg" - "Italy" - "France" - "Cottbus" --- Fraunhofer IPMS startet die APECS-Pilotlinie in Dresden, Freistaat Sachsen; eröffnet neue Tech-Möglichkeiten und stärkt regionale Wertschöpfungsketten langfristig Fraunhofer IPMS - Annual Report 2025 / 2026 2025 / 2026 Annual Report Annual Report 2025 / 2026 We do research for the people. Application-orientated, innovative and professional. With over 600 employees, Fraunhofer IPMS develops innovative, customer-specific solutions in the fields of smart industry, medical & health technologies and mobility at four sites in Dresden, Cottbus and Erfurt. We put a special focus on green microelectronics and novel memory technologies for the next generation of high performance electronics. Our research focuses on miniaturized sensors and actuators, integrated circuits, wireless and wired data communication, customer- and application-specific micro- electro-mechanical systems (MEMS) as well as leading- edge 300 mm technologies for future applications in digital, neuromorphic and quantum computing. As a reliable and competent research partner, we provide our customers with complete solutions from the initial concept and technology development to the model and pilot production on 200 mm wafers in our own cleanroom using qualified, industry-orientated processes. The development of processes and materials on 300 mm wafers completes our range of services. Learn more about us in our short video, where we introduce our institute. Video "Our institute in Dresden from above" About Fraunhofer IPMS Foreword Pioneering Semiconductor Technology Quantum Technologies Novel memory technologies Neuromorphic Computing & Edge AI Bio & Health Sensorik & AI Digitalization & Data Communtication Microdisplays Highlights Fraunhofer IPMS at a glance 2 Annual Report 2025 / 2026 Prof. Dr. Harald Schenk Executive Director Dear friends and partners of the Fraunhofer Institute for Photonic Microsystems, Fraunhofer IPMS looks back on a very successful year in 2025. The high global demand for semiconductors demonstrates the importance of microelectronics. This is particularly evident in Dresden: major investments and the close integration of research, development, and production strengthen the region's unique ecosystem. Fraunhofer IPMS is a key player and reliable partner for industry, politics, and science. Our technologies and research priorities have been very well received, enabling us to close 2025 with a positive annual result and many innovative contributions for our customers and stakeholders. A key milestone at the beginning of the year was a Saxonian event celebrating the launch of the APECS pilot line – Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems, which is being implemented by the Research Factory Microelectronics Germany (FMD). The associated investments open up new technological possibilities and lay the foundation for future innovation and value creation potential. We would like to express our special thanks to the EU, the German federal government, and the participating states, in particular the Free State of Saxony, for their substantial support and the trust they have placed in our work. Foreword Another highlight of the year was the 20th anniversary of our Center for Nanoelectronic Technologies (CNT). The anniversary event and the subsequent Industry Partner Day impressively demonstrated how sustainable and trusting our long- standing collaborations with our industry partners are. The consistently positive feedback confirms the success of the Dresden model: a collaboration along the entire microelectronic value chain that is unique in Europe. In addition to our main location in Dresden and our Center Nanoelectronic Technologies, our Cottbus site is also undergoing continuous development. In 2026, we will lay the foundation stone for new office and laboratory buildings, which will be used in particular for our pioneering research in the field of embodied AI. Close cooperation with the Brandenburg University of Technology Cottbus-Senftenberg and the Lausitz Science Park strengthens the regional innovation and education system and opens up additional synergies for our projects. The German government's high-tech agenda and the microelectronics strategy jointly adopted for the first time by the Federal Ministry of Research, Technology, and Space (BMFTR) and the Federal Ministry for Economic Affairs and Energy (BMWiE) underscore the importance of precisely those topics that Fraunhofer IPMS has been shaping for years. In addition to microelectronics, there is increasing focus on quantum technologies, sensor technology & artificial intelligence, as well as neuromorphic computing. These promising fields of research are also reflected in the contents of this annual report. The outlook is clearly European: preparations for future initiatives such as the European Chips Act II and other Important Projects of Common European Interest (IPCEI) are already underway. Fraunhofer IPMS is specifically preparing to take on responsibility and contribute to Europe's technological sovereignty. Together with our partners, we want to continue to play a key role in shaping the development of key technologies and exploiting Europe's technological opportunities. We would like to express our sincere gratitude for your trust and close cooperation as customers, sponsors, and partners of our institute. On the following pages, we provide insights into a year full of progress, ideas, and joint successes. We look forward to continuing to advance technological innovations together with you and actively shaping the future of microelectronics and related key technologies. Enjoy reading it! Foreword Harald Schenk About Fraunhofer IPMS Pioneering Semiconductor Technology Quantum Technologies Novel memory technologies Neuromorphic Computing & Edge AI Bio & Health Sensorik & AI Digitalization & Data Communtication Microdisplays Highlights Fraunhofer IPMS at a glance 3 Pioneering Semiconductor Technology Annual Report 2024 / 2025 Annual Report 2025 / 2026 Pioneering Semiconductor Technology The European Chips Act and European pilot lines: Paving the way for innovation and competitiveness Pioneering semiconductor technology The European Chips Act is a strategic initiative of the European Union aimed at sustainably strengthening semiconductor and microelectronics manufacturing in Europe. Through targeted investments in research, innovation, and production infrastructure, Europe aims to secure technological independence and competitiveness while also increasing the resilience of the entire value chain. The Act places a strong emphasis on promoting joint research and development projects that accelerate the transfer of scientific findings into industrial applications. A central element of the European Chips Act is the “Chips for Europe Initiative,” which primarily supports the development and testing of new technologies in so-called pilot lines. The goal of these pilot lines is to bring research and development results to a level that enables the leap to industrial applications, while simultaneously creating open access for academic institutions, research organizations, SMEs, and industry. Overview of the five pilot lines As part of the Chips for Europe initiative, five pilot lines have been launched, each addressing different key areas of the semiconductor industry: NanoIC (coordinated by imec / Belgium)  Development of chips “beyond 2 nm” – state-of-the-art system-on-chip technologies FAMES (coordinated by CEA-Leti / Frankreich)  FD‑SOI technologies for energy-efficient and ultra-low power semiconductors APECS (coordinated by Fraunhofer-Gesellschaft and implemented by Research Fab Microelectronics / Germany)  Advanced packaging and heterogeneous integration for electronic components and systems WBG (coordinated by CNR / Italy)  Wide bandgap materials for power electronics and innovative application PIXEurope (coordinated by ICFO / Spain)  Photonic integrated circuits for optical systems These pilot lines cover the entire spectrum, from chip production and integration to novel materials and photonic components, and serve as building blocks for a more integrated European semiconductor network. Significance for Fraunhofer IPMS The European Chips Act opens up far-reaching strategic opportunities for Fraunhofer IPMS to further strengthen its position as a leading research institution in micro- and nanoelectronics. Through its involvement in the European pilot lines APECS and FAMES, the institute can expand its technological capabilities and thereby lay the groundwork for future-oriented developments in Germany and Europe. Within APECS, for example, Fraunhofer IPMS is working The pilot lines provide a framework within which Fraunhofer IPMS can combine strategically relevant research, future-oriented expertise, and economic impact. At the same time, the institute strengthens Saxony’s position as the leading high-tech cluster “Silicon Saxony” by pooling knowledge, infrastructure, and highly qualified professionals in the region. Through its participation in international pilot projects, Fraunhofer IPMS also contributes to the training of young scientists and skilled workers who are of central importance to the European semiconductor industry. Furthermore, the institute uses its expertise to support Europe’s pioneering role in the semiconductor industry and helps ensure that Europe continues to strengthen its technological independence and competitiveness. More on Fraunhofer IPMS in APECS - p. 6f More on Fraunhofer IPMS in FAMES - p. 38 About Fraunhofer IPMS Foreword Quantum Technologies Novel memory technologies Neuromorphic Computing & Edge AI Bio & Health Sensorik & AI Digitalization & Data Communtication Microdisplays Highlights Fraunhofer IPMS at a glance 5 Annual Report 2025 / 2026 Pioneering Semiconductor Technology Fraunhofer IPMS within APECS System design  Chiplets for computing and AI  Design for quasi-monolithic (QMI) heterointegration Chiplet integration  Functional integration (QMI, 3D stack integration, 2.5D integration on wafer level, chiplet functionalization)  Functional interposers with ultra-high density  CMOS + MEMS/Non-silicon chiplets Characterization, Test & Reliability Development of testing technologies, qualification, and adaptation of system technology and CTR kits for:  2.5D/3D/quasi-monolithic integration  Wafer-level test  Functional testing of the der modules Fraunhofer IPMS is receiving €117 million in funding as part of the APECS pilot line for the procurement and modernization/retrofit of equipment, as well as its installation and operation. As a result, Fraunhofer IPMS plays a crucial role in the APECS pilot line and will drive the project’s goals in chiplet development and integration technology. One part focuses on the design of the chiplet system, where we are developing innovative system architectures for computing, artificial intelligence, and MEMS sensors/actuators. The second major part encompasses new chiplet integration technologies on 200 and 300 mm wafers, including 3D stacking and 2.5D wafer-level integration, ultra-high- density functional interposers, and CMOS and MEMS/ non-silicon chiplets. A key component of our work is the development of quasi-monolithic integration (QMI), which will set new standards in chiplet integration technology. In addition, as part of APECS, we are working on the implementation of functional safety requirements in the design of integrated circuits. To this end, we are developing design flows for the modeling of IP cores, which we are implementing as examples in our RISC-V and TSN IP cores. Research in the areas of characterization, testing, and reliability rounds out our research portfolio. This project is funded by the European Union's Regional Development Fund (EFRE). Website € 730 M Total funding for APECS of which € 117 M for Frau