---
title: "Siltronic AG is the only Western-based wafer manufacturer worldwide; Strengthens Western tech sovereignty amid AI demand"
sdDatePublished: "2026-08-04T09:05:00Z"
source: "https://www.siltronic.com/fileadmin/investorrelations/2026/Q2/20260730_Siltronic_Investor_Presentation_2.pdf"
topics:
  - name: "semiconductor and electronic component"
    identifier: "medtop:20000230"
  - name: "business strategy and marketing"
    identifier: "medtop:20000192"
  - name: "business information"
    identifier: "medtop:20000170"
  - name: "market trend"
    identifier: "medtop:20000284"
  - name: "manufacturing and engineering"
    identifier: "medtop:20000294"
locations:
  - "Portland"
  - "Oregon"
  - "Altötting"
  - "Munich"
  - "Dresden"
  - "Leipzig"
  - "Chemnitz"
  - "Freiberg"
  - "United States"
  - "Singapore"
  - "Germany"
---


Siltronic AG is the only Western-based wafer manufacturer worldwide; Strengthens Western tech sovereignty amid AI demand

© Siltronic AG
Investor Relations
July 30, 2026
FOUNDATION OF
DIGITAL LIFE

© Siltronic AG
SILTRONIC AT A GLANCE
2
Investor Presentation - July 2026
4,300
employees
worldwide
4
world-class
production sites
Supplier
to top
semiconductor producers
50+
years of history
in silicon technologies
1.35
billion EUR
sales in 2025
23.5
percent
EBITDA margin in 2025
© Siltronic AG

© Siltronic AG
50+ YEARS OF HISTORY – A STORY OF SUCCESS AND INNOVATION
3
Investor Presentation - July 2026
1978
Foundation of
Wacker Siltronic
Corporation
Portland (US)
1997
Foundation of
Wacker Siltronic
Singapore Pte. Ltd
(“SSP”)
2016
Inauguration of
new crystal
pulling hall in
Freiberg
2019
Inauguration of the
new crystal pulling
hall in Singapore
2023
Inauguration of
crystal pulling
hall extension in
Freiberg
1968
Foundation of
Wacker-
Chemitronic
GmbH
1995
Acquisition of
Freiberg fab
2006
Foundation of 50:50
JV with Samsung
(“SSW”) and
construction start of
a 300 mm fab
2014
Increase
stake in SSW
to 78 percent
2021
Groundbreaking
of new fab in Singapore
& expansion of
crystal pulling
hall in Freiberg
1984
First 200 mm
wafers at
Wacker-
Chemitronic
1990
First research and
development
projects for 300
mm wafers
2015
Siltronic
executes
successful IPO
1999
Start of 200 mm
production at
Siltronic fab
Singapore Pte Ltd.
2024
Inauguration of
the new fab in
Singapore
2004
Siltronic opens new
300 mm fab in
Freiberg

© Siltronic AG
OUR INTERNATIONAL PRODUCTION NETWORK
SERVES CUSTOMERS AROUND THE GLOBE
4
Investor Presentation - July 2026
*JV with Samsung Electronics
Leading
Edge
production
R&D
hub in Burghausen
300 mm
volume production in
Germany & Singapore
USA (Portland / Oregon)
Singapore
Germany (Burghausen, Freiberg)
Singapore
Germany
USA
SSW*
SSP
CP
300
mm
200
mm
300
mm
CP
200
mm
JV = Joint Venture
CP = Crystal Pulling
R&D = Research and Development

© Siltronic AG
Source: TechInsights & other companies, WSTS (Silicon based), SEMI SMG, Siltronic Marketing
THE WAFER SUPPLIERS ARE FUELING THE WHOLE ELECTRONICS
VALUE CHAIN
5
Investor Presentation - July 2026
Electronics
value chain
(figures for 2025)
End markets
USD >5,000 bn
Semiconductor
device makers
USD 786 bn
Silicon for electronic
applications
USD 1.4 bn
With fabs
Samsung, Infineon,
TSMC, Intel, Micron,
SK Hynix…
Design only
Nvidia, AMD,
Qualcomm…
Smartphones
Apple,
Samsung…
PCs
Lenovo,
HP, Dell…
Industrials
Siemens, GE…
Servers / AI
Microsoft,
Google, AWS,
Meta…
Automotive
Toyota, VW,
BMW, Tesla…
Others e.g.
White goods,
Infrastructure,
Gaming…
5
major suppliers
5
major suppliers
>1,300 fabs
and roughly 50 larger
chip designers
>10,000
companies
Semiconductor
silicon wafers
USD 11.4 bn
Wacker Chemie,
Hemlock, OCI,
Tokuyama,
Mitsubishi

© Siltronic AG
SILTRONIC IS WELL POSITIONED AS THE ONLY
WESTERN-BASED WAFER MANUFACTURER
6
Investor Presentation - July 2026
Only western
based wafer
manufacturer
Around 75%
of the market is
served by the Top 5
wafer manufacturers
SK Siltron
Shin Etsu
Sumco
Global
Wafers
Top 5
Wafer
manufacturers
Source: Q1 – Q3 2025 Quarterly revenue reports by SEMI reporting companies with Siltronic estimates on silicon wafer revenues

© Siltronic AG
SILTRONIC HAS A WELL-DIVERSIFIED AND RESILIENT
PRODUCT MIX IN ALL THREE SEMI-SEGMENTS
7
Investor Presentation - July 2026
Source: Siltronic Marketing
Power
Leading position
Leading Edge
Supplier
Demand by segments in % of total demand in 2025
26%
37%
37%
Market
Memory
Logic
Power/Others

© Siltronic AG
WAFER DEMAND GROWTH EXPECTED TO
CONTINUE (CAGR1 5-6%), DRIVER: 300 mm WAFERS
8
Investor Presentation - July 2026
Source: Siltronic estimates; 1CAGR = Compound Annual Growth Rate (2000-2025)
CAGR 1%
for 200 mm
CAGR 6%
for 300 mm
Wafer Demand per Diameter
in mn 300 mm equivalents

© Siltronic AG
END MARKETS (PRE INVENTORY) EXPECTED TO
GROW BY 7 PERCENT
9
Investor Presentation - July 2026
¹Infrastructure Telecommunications, game consoles, consumer electronics such as televisions, white goods such as refrigerators
Source: Siltronic estimates as of June 2026
Growth in Wafer Area Consumption, in % yoy
Split wafer consumption
by end use in 2025
Smartphones
Servers
Automotive
PCs
Industry
Others1
2026e
-11%
46%
3%
-10%
13%
3%
7%
Total w/o inventory
21%
18%
16%
14%
13%
18%
100%
2025
3%
30%
18%
12%
2%
3%
8%
Inventory impact
on wafer demand
Memory
rebuilding,
Power elevated
Cars
with continued
moderate growth
Server
driven by AI
Industry
gaining further
momentum

© Siltronic AG
MEGATRENDS CONTINUE TO DRIVE WAFER DEMAND
10
Investor Presentation - July 2026
Key benefits
from strategic focus on
Leading Edge and
Power market
All segments
are growing
Siltronic
is well positioned to
support each
megatrend
Artificial
Intelligence
Digitalization
Renewables
Industry 4.0
Autonomous
vehicles &
Electromobility
Security

AI IS DRIVING WAFER DEMAND ACROSS ALL END MARKETS,
WITH STRONGEST IMPACT IN SERVERS
11
Investor Presentation - July 2026
© Siltronic AG
Smartphones
Cars
PCs
Industrials
Servers
Growth in wafer area
consumption (% yoy)

© Siltronic AG
Source: Siltronic estimates, 1 Silicon wafer area per device
AND CONTENT IN END PRODUCTS IS GROWING WITH NEW PRODUCTS
ENTERING THE MARKET
12
Investor Presentation - July 2026
Content 20151
Smartphone
(high end)
Content 20251
Car
(upper
middle class)
Server
Smartwatch
Wireless earphones
9 cm2
12 cm2
54 cm2
110–130 cm2
230 cm2
600–770 cm2
Examples for new applications that did not exist
ten years ago
2–4 cm2
1–2 cm2
incl. base station
More Memory and
Image sensors
Digitalization, ADAS
and Entertainment
Cloud and Artificial
Intelligence

© Siltronic AG
Company Confidential © Siltronic AG
Company Confidential
13
Investor Presentation - July 2026
ADDITIONAL SINGAPORE
CAPACITY SUPPORTS DEMAND
FAB HIGHLIGHTS
EBITDA further developing towards
group margin level
Highly automated and substantial epi share,
with high economies of scale
Further ramp depending on market development
Targeted mid-term EBITDA margin: 50%+
Fab operating as planned and serving
Leading Edge customers

© Siltronic AG
IN FREIBERG WE FURTHER IMPROVED PRODUCT
MIX FUELED BY INVESTMENTS
14
Investor Presentation - July 2026
Source: Siltronic; Silicon Saxony/Wirtschaftsförderung Sachsen
First-class
geographical position
in light of EU ambitions
Investments
of more than EUR 1 bn
since 1995 by Siltronic
Every
2nd to 3rd
semiconductor in the
EU is from this region
Chemnitz
Dresden
Leipzig
Bosch
Infineon
TSMC
GlobalFoundries
NXP
1 cm = 28.25 km

© Siltronic AG
WAFER PRODUCTION PROCESS
15
Investor Presentation - July 2026

© Siltronic AG
STRONG FOCUS ON GROWTH DRIVERS R&D AND
INNOVATION
16
Investor Presentation - July 2026
R&D
hub in Burghausen
450
R&D employees
1,900
patents
5-6%
of sales planned
as R&D spendings
R&D Innovation Strategy
o Stay one generation ahead
as a Technology Leader
o Focus on Leading Edge and Power
o Find new business opportunities and
expand our product portfolio
Partnering with leading innovation
platforms
+
=

© Siltronic AG
2002
65 nm
2005
65 nm
2007
45 nm
2009
32 nm
2011
22 nm
2013
8 nm
2016
10 nm
2018
8 nm
2020
5 nm
2022
3 nm
2024
2 nm
2026
A14
SILTRONIC HAS A PROVEN TRACK RECORD AS A TECHNOLOGY
LEADER
17
Investor Presentation - July 2026
Commercialization
R&D Start
2004
45 nm
2006
32 nm
2008
22 nm
2009
16 nm
2012
10 nm
2014
16 nm
2016
5 nm
2019
3 nm
2021
2 nm
2023
A14
2025
A10

© Siltronic AG
A NUMBER OF KEY INGOT AND WAFER PROPERTIES DEFINE THE
WAFER SPECIFICATION AND ITS FURTHER USE BY THE CUSTOMER
18
Investor Presentation - July 2026
DATA

© Siltronic AG
19
Investor Presentation - July 2026
nm = nanometer
PURITY AND FLATNESS REQUIREMENTS FOR WAFERS ARE EXTREME,
AS SCALING THEM INTO THE MACRO WORLD SHOWS
Particles
Particle size specified in the nm range. Requirements are
equivalent to a maximum of 10 grains of sand distributed
over the city of Munich.
Flatness
20 nm on a wafer are equivalent to the height of a leaf on
the surface of Lake Chiemsee – or a single bacteria on a
tennis court.

© Siltronic AG
FINANCIALS AND
OUTLOOK
Investor Presentation - July 2026
20

© Siltronic AG
21
Investor Presentation - July 2026
SUCCESSFUL CAPITAL INCREASE
Use of Proceeds
o Supporting long-term growth and capturing market opportunities
o Strengthening the balance sheet and increasing financial flexibility
HAL Trust
SIZE
EUR 273 mn
Gross issuance proceeds
PRICE
EUR 91.00
~7% discount to prior day's
closing price
CAPITAL INCREASE
10%
of existing share capital
(3.0m new shares)
METHOD
ABB
Accelerated Bookbuilding,
subscription rights excluded
Investor Base Quality
o High participation from new and existing long-only investors
o Anchor shareholder HAL supported the transaction with a
meaningful order
o Strong demand among European and US investors

© Siltronic AG
STRONG LIQUIDITY POSITION AND BALANCED
DEBT MATURITY PROFILE
22
Investor Presentation - July 2026
Figures rounded
SSD = Schuldscheindarlehen (Promissory Note Loan)
Debt Financing Instruments
in EUR million
Interest
expenses in the
ballpark of EUR 50 mn
in 2026
Prepayments
of around EUR 10 mn
expected to be
refunded in 2026
-936
Variable loans, drawn
Syn loan, not drawn yet
Fixed loans, drawn
SGP
229
EIB
175
SSD
280
SSD
390
Syn loan
253
Syn loan
127
1,454
Maturity Profile of Debt Financing
in EUR million
Cash & Securities
in EUR million
June 30, 2026
650
Syn loan
(not drawn)
127
H2
2026
2027
2028
∑ 2029
– 2033
63
250
220
790

© Siltronic AG
23
Investor Presentation - July 2026
Chart not to scale
CAPEX SIGNIFICANTLY REDUCED SINCE PEAK IN
2023
Capital expenditure
in EUR million
188
426
1.074
1.316
523
369
2020
2021
2022
2023
2024
2025 2026e
Capability
enhancement “staying
one generation ahead”
Maintenance
of business
Cost
efficiency
e.g. automation
Capital expenditure
expected
Product mix
ongoing improvement
180-220
Brownfield capex for
the new Singapore fab
Steady state capex
∅EUR 200 mn p.a.

© Siltronic AG
SILTRONIC WITH HIGH CASH, COST AND CAPITAL
ALLOCATION DISCIPLINE
24
Investor Presentation - July 2026
Depreciation
Labor
Supplies
Polysilicon
Energy
Cash
management
Cost
reduction
program
Capital
allocation
Major cost items 2026

© Siltronic AG
EPIC Supplier
Award
Intel, April 2025
Best Supplier
Award
SSMC, September 2025
BEST in Value
Award
Samsung, September 2025
Outstanding
Supplier
Performance
Award
Micron, November 2025
SILTRONIC’S TECHNOLOGICAL LEADERSHIP AND EXCELLENCE
RECOGNIZED WITH MULTIPLE AWARDS IN THE LAST 12 MONTHS
25
Investor Presentation - July 2026
Best Silicon
Supplier Award
ST, November 2025

© Siltronic AG
2026 SALES GUIDANCE EDGED UP
26
Investor Presentation - July 2026
1 EUR/USD exchange rate 1.18 for H2 2026, 2 Excluding the impact of the closure of the Small Diameter business and FX impact
Sales
Low to mid-single digit below 20251
like for like on or slightly above 20252
EBITDA margin
Between 20% and 24%
Capex
Between EUR 180 and 220 mn
EBIT
Significantly below the previous year
Depreciation
Between EUR 490 and 520 mn
Net Cash Flow
In the range of the previous year
© Siltronic AG

© Siltronic AG
ESG
@ SILTRONIC
Investor Presentation - July 2026
27
Clear commitment to an emission-free future

© Siltronic AG
28
Investor Presentation - July 2026
SILTRONIC IS ENABLING TECHNOLOGIES FOR A
SUSTAINABLE FUTURE
Power focus
Leading Edge focus
R&D focus
is crucial for
sustainability strategy
Investments
needed to keep our
equipment state of the
art for Leading Edge
wafers
Strategy
on Leading Edge and
Power wafers supports
sustainability strategy
New chip generations
increase energy efficiency
and need less power
Focus on Power wafers
+
R&D focus in special products
and new materials
Leading Edge wafers
+
R&D focus on new
Design Rules
Power chips are crucial for
decarbonization and enable
renewable energies and EV’s

© Siltronic AG
¹Absolute reduction, base year 2021; ²Net zero: GHG emissions released into the at