---
title: "ZEISS SMT showcases advanced packaging at SEMICON Taiwan 2026, Taipei; DUNE 100 rollout in Taiwan begins late September"
sdDatePublished: "2026-09-03T11:24:00Z"
source: "https://www.zeiss.com/semiconductor-manufacturing-technology/news-and-events/smt-press-releases/2026/semicon-taiwan.html"
topics:
  - name: "semiconductor and electronic component"
    identifier: "medtop:20000230"
  - name: "trade show or expo"
    identifier: "medtop:20001136"
  - name: "artificial intelligence"
    identifier: "medtop:20001298"
  - name: "research and development"
    identifier: "medtop:20000208"
locations:
  - "Taipei"
  - "South Korea"
  - "Taiwan"
  - "Germany"
---


ZEISS SMT showcases advanced packaging at SEMICON Taiwan 2026, Taipei; DUNE 100 rollout in Taiwan begins late September

SEMICON Taiwan 2026: ZEISS SMT focuses on Advanced Packaging

ZEISS at SEMICON Taiwan 2026

At SEMICON Taiwan 2026, ZEISS SMT positions as a technology partner for the next generation of semiconductor production.

The focus will be on advanced packaging as well as metrology and inspection solutions that enable greater precision and stability in complex production processes.

With the trade show ZEISS SMT underscores the importance of staying close to customers in a leading semiconductor market with strong production capabilities and a dense innovation ecosystem.

ZEISS Semiconductor Manufacturing Technology (SMT) will be represented at SEMICON Taiwan in Taipei from September 2 to 4, 2026. The trade show presence will focus on advanced packaging and technologies that support customers as process complexity rises, tolerances become tighter, and requirements for yield and stability increase.

ZEISS SMT enables lithography manufacturing with its strategic partner ASML by developing its optical systems. Additionally, with solutions from its Semiconductor Mask Solutions and Semiconductor Fab Solutions portfolios, ZEISS SMT helps chip manufacturers control complex production steps more reliably: from technologies for highly precise photomasks, which serve as templates for chip structures in lithography, to the inspection and metrology of fine structures on wafers, and the control of deformations. Taiwan is one of the world’s leading semiconductor hubs and continues to gain strategic importance as demand grows for high-performance semiconductors used in artificial intelligence applications. The dense ecosystem of foundries, fabless companies, memory manufacturers, packaging providers, research institutions, mask shops and suppliers accelerates innovation and technology adoption across the entire value chain.

ZEISS DUNE 100 measures wafer deformations and supports targeted correction in complex semiconductor processes.

ZEISS NLX makes inner structures of modern chip packages visible without destroying them.

Precision and process control for advanced packaging

Advanced packaging is becoming a strategic priority because chip manufacturers need to enable higher performance, lower energy consumption, and more functions in a smaller space. At the same time, requirements for measurement accuracy, defect detection, and process stability are increasing as chip structures become smaller, denser, and more three-dimensional. "Taiwan is a key site for the global semiconductor industry and a market where new requirements for performance, integration, and production precision become visible particularly early. For ZEISS SMT, SEMICON Taiwan is therefore an important platform for deepening direct exchange with customers and partners. This proximity helps us better understand technological developments and align solutions with the requirements of the next chip generation," says Dr. Frank Rohmund, President and CEO of ZEISS Semiconductor Manufacturing Technology and Member of the ZEISS Executive Board. "Advanced packaging significantly increases the requirements for process control and defect detection. Our solutions help customers make complex structures on the wafer or in the package visible, keep processes stable, and transfer new technologies into reliable production more quickly," says Dr. Karoline Piegdon, Head of Semiconductor Fab Solutions at ZEISS SMT.

Greater control for complex chip structures

ZEISS NLX shows what this kind of process control can look like. The system makes the internal structures of modern chip packages visible without destroying them. This allows chip manufacturers to inspect connections between stacked dies, for example, and detect potential defects at an early stage. Designed for 300 mm wafers, ZEISS NLX supports both process development and use in volume production. ZEISS DUNE helps to control wafer bow in a targeted way. The system measures the wafer’s topography and can correct it individually. This is especially important in complex production steps, for example, to avoid yield losses during further processing or when preparing for bonding. In addition, ZEISS SMT is strengthening local availability of this technology in Taiwan: starting at the end of September, installation of a ZEISS DUNE 100 system will begin in Taiwan to enable customers to discuss specific applications directly on site.

Broad range of mask solutions enables flawless production of high-end photomasks

ZEISS SMT's Semiconductor Mask Solutions strategic business unit (SMS) provides leading solutions for reliably manufacturing high-quality photomasks to the market. One example of this is the new AIMS ® EUV 3.0 system, which is deployed globally at major semiconductor manufacturers. This new generation sets a benchmark in photomask qualification, crucial for performance and functionality of next-generation chips. For ZEISS SMS, Taiwan is a very important market as many technology requirements for top notch photomask production become visible in Taiwan at an early stage. "We focus on continuous improvement and innovation, ensuring that our customers have state-of-the-art technology available to succeed in a rapidly evolving industry,” says Dr. Clemens Neuenhahn, Head of Semiconductor Mask Solutions at ZEISS SMT. "Close exchange with local customers and partners helps us understand where the industry is heading and align our mask solutions with the requirements of next-generation chip manufacturing."

With its presence at SEMICON Taiwan, ZEISS SMT is building on its efforts to stay close to customers in key Asian semiconductor markets. In July 2026, ZEISS SMT opened a Semiconductor Innovation Center in Yongin, Korea, to deepen collaboration with customers and provide local access to selected solutions for high-volume wafer production, wafer-level packaging, and photomask production. The center supports on-site development, process optimization, and faster qualification for high-volume production environments.

For Taiwan as well, ZEISS SMT plans to further expand access to technologies and application-focused exchange on site in the future.

ZEISS is an internationally leading technology enterprise operating in the fields of optics and optoelectronics. In the previous fiscal year, the ZEISS Group generated annual revenue totaling almost 12 billion euros in its four segments Semiconductor Manufacturing Technology, Industrial Quality & Research, Medical Technology, and Consumer Markets (September 30, 2025).

For its customers, ZEISS develops, produces, and distributes highly innovative solutions for industrial metrology and quality assurance, microscopy solutions for the life sciences and materials research, and medical technology solutions for diagnostics and treatment in ophthalmology and microsurgery. The name ZEISS is also synonymous with the world's leading lithography optics, which are used by the chip industry to manufacture semiconductor components. There is global demand for trendsetting ZEISS brand products such as eyeglass lenses, camera lenses, and binoculars.

With a portfolio aligned with future growth areas like digitalization, healthcare, and Smart Production and a strong brand, ZEISS is shaping the future of technology and constantly advancing the world of optics and related fields with its solutions. The company's significant, sustainable investments in research and development lay the foundation for the success and continued expansion of ZEISS' technology and market leadership. ZEISS invests 14 percent of its revenue in research and development – this high level of expenditure has a long tradition at ZEISS and is also an investment in the future.

With over 47,400 employees, ZEISS is active globally in around 50 countries with more than 60 sales and service locations, around 40 research and development facilities, and 30 production facilities worldwide (March 31, 2026). Founded in 1846 in Jena, the company is headquartered in Oberkochen, Germany. The Carl Zeiss Foundation, one of the largest foundations in Germany committed to the promotion of science, is the sole owner of the holding company, Carl Zeiss AG.

With its product portfolio and expertise, the Semiconductor Manufacturing Technology segment of ZEISS covers a variety of key processes in the production of microchips. Its products include semiconductor manufacturing optics – notably lithography optics – as well as photomask systems and solutions for leading-edge microchip and chiplet production. Thanks to ZEISS technology, microchips are becoming increasingly smaller, more powerful, more energy-efficient and more affordable. The electronic applications of these ongoing enhancements enable global progress in many disciplines such as technology, electronics, communication, entertainment, mobility and energy. Semiconductor Manufacturing Technology is headquartered in Oberkochen. Other sites include Jena, Rossdorf, Wetzlar, Aachen and Coswig (Germany), Zurich (Switzerland), as well as Bar Lev (Israel) and Dublin, CA (USA). ZEISS SMT also operates various sales and service sites in the US, China, Taiwan (region), South Korea and Japan.

ZEISS DUNE ZEISS DUNE 100 measures wafer deformations and supports targeted correction in complex semiconductor processes. 2 MB Download

ZEISS NLX ZEISS NLX makes inner structures of modern chip packages visible without destroying them. 1 MB Download

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